Photonic system-on-chip (SoC) startup Scintil Photonics has closed a $58 million Series B funding round, which saw participation from Nvidia.

The round was led by Yotta Capital Partners and NGP Capital and was backed by existing investors Supernova Invest, Bpifrance, Innovacom, Robert Bosch Venture Capital (RBVC), Applied Ventures, ITIC-Taiwan, and new investor BNP Paribas Développement.

Founded in 2018 by now CTO Sylvie Menezo, the company develops and commercializes laser-integrated photonics for AI data centers based on its Scintil Heterogeneous Integrated Photonics (SHIP) technology, which Scintil says enables low-latency, high-density, and power-efficient ultra-high-speed optical interconnects.

The technology combines silicon and indium phosphide photonics and can be fabricated in commercial semiconductor foundries. Scintil said it is based on technology that was first developed more than 15 years ago at the French semiconductor research institute, CEA-Leti.

Scintil said it plans to use the funding to increase its global workforce and expand its presence in the US, in addition to accelerating the production of its single-chip DWDM (Dense Wavelength Division Multiplexing) light engine, described by the company as “the industry’s first.”

Aligned with next-generation co-packaged optics (CPO), Scintil’s DWDM offering integrates multi-wavelength lasers with silicon photonics to support the high-bandwidth, low-latency, and high-density demands of next-generation AI infrastructure.

The company said the device achieves this by outputting “many precisely spaced and multiplexed wavelengths, dramatically increasing bandwidth and decreasing energy requirements.” By lowering power per bit, Scintil’s LEAF Light technology – a dense, multi-wavelength laser source fabricated with SHIP circuit technology – helps to reduce the carbon footprint of AI data centers.

“This investment marks a pivotal moment for Scintil as we move to full-scale deployment,” said Matt Crowley, CEO of Scintil Photonics. “Our SHIP technology enables integrated photonic solutions with the scalability, energy efficiency, and integration density required to power next-generation compute infrastructure. This efficiency not only reduces data center operating costs but also contributes to lowering the carbon footprint of AI infrastructure. With LEAF Light entering high-volume production, we’re expanding from our base in Grenoble into the international markets, including the US, to support the world’s most advanced AI factories.”

CTO Menezo added: “From the beginning, our vision with SHIP has been to integrate lasers, modulators, and photodetectors into a single manufacturable platform. LEAF Light is the first proof of this process, demonstrating that heterogeneous photonic integration can deliver the bandwidth density and energy efficiency AI infrastructure requires, while remaining fully compatible with commercial foundry production. SHIP provides the foundation to scale optical integration for the next decade of AI and compute systems.”